Hardware Thermal Pad on Memory Modules and on top of the Shim?

[aranorde]

Pictures from @Rain82 's post

I would also like to do something like this to improve the Switch's thermal performance. I just want to know if its actually effective or maybe not all that required. Also would like to know the preferred thermal pad thickness for this.
I like to juice every bit of performance out of this and I have some 16W/mk .5mm thermal pads laying around that I can use - hope it fits.

Any help is appreciated.

 

[Medel87]

First image 0.5mm, second image 1.5mm, you can put 0.5mm at pipe and nand, pipe only the part near the shim, or in the metal case like second image

 

[l7777]

Unneeded. The memory chips don't get hot enough to need it and the shield won't dissipate any more heat than the heat pipe. Don't overthink it, just replace the thermal compound between the CPU and the heat pipe.

 

[aranorde]

First image 0.5mm, second image 1.5mm, you can put 0.5mm at pipe and nand, pipe only the part near the shim, or in the metal case like second image

Thanks, are you sure its 1.5mm outside? I've been searching around and found that 1.0mm is enough. Thicker pads can bend the shield plate apparently.

Edit :

You can see that there is quite a bit of indent in the plate, so once flipped the gap is much closer to the shim. (Area marked in 3).

 

[Medel87]

Thanks, are you sure its 1.5mm outside? I've been searching around and found that 1.0mm is enough. Thicker pads can bend the shield plate apparently.

Edit :

You can see that there is quite a bit of indent in the plate, so once flipped the gap is much closer to the shim. (Area marked in 3).
View attachment 378039

Yes, only yellow is 1.5mm, the other three are 0.5mm

 

[aranorde]

Yes, only yellow is 1.5mm, the other three are 0.5mm

So 0.5mm on NAND, 0.5mm on the heat-pipe and 1.5mm on the shim?

Also I have some Thermal Putty (Zezzio ZT-PY6 13W/mk same as my 0.5mm pads), I think replacing the pad with the putty on the heat-pipe will be a better solution here. What do you think?

 

[isoboy]

Unneeded. The memory chips don't get hot enough to need it and the shield won't dissipate any more heat than the heat pipe. Don't overthink it, just replace the thermal compound between the CPU and the heat pipe.

Let the kids play, lol.

 

[Medel87]

So 0.5mm on NAND, 0.5mm on the heat-pipe and 1.5mm on the shim?

Also I have some Thermal Putty (Zezzio ZT-PY6 13W/mk same as my 0.5mm pads), I think replacing the pad with the putty on the heat-pipe will be a better solution here. What do you think?

Yes, and 0.5mm at rams too.

About thermal putty, I don't know if it will be better.